| Product > Packaging Road Map |
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| - Road Map | |
| - High-Density Stacked Die | |
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| - PIP & COB(chip on board) package for small form factors | |
| - CIS Package | |
| - CCM Package | |
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Packaging Road Map | ||
Kingpak technology evolution
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| Technology Application Development Significant--- 2007~2009 | |||
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