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BGA Technology | ||
Kingpak's Stacked
MCP(Multi-Chip-Package)packing technology combines various combinations
of Nand Flash or Nor Flash,Psuedo SRAM and SRAM in a single packing
process.With Kingpak's MCP packing technology,three chips are combined
to reduce their size for placement inside camera cell phones.Kingpak
also uses "stacked technology" to add memory capacity
and reduce the need for packing space. |
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TESTING SERVICE | ||
| IC Final Test Equipment | |||
| Kingpak Memory Tester | |||
| DRAM Product Tester ¡V T5585 / T5593 | |||
| DRAM Product Tester Handler ¡VM6541AD / M6542AD | |||
| Flash Product Tester ¡V HT3302 / HT3300 / PK2 / HT8080 | |||
| IC Burn-In Test Equipment | |||
| Burn-in Oven - JEC P-1600NS X 2 / JEC P3503 | |||
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