Kingpak Technology established in 1997 and the fist Tiny BGA package and CMOS sensor package factory of the Asia, up to now Kingpak possesses 800 patents applied around the world.

We have held the CIS business for five years and not only produce the large quantities, but also the high quality. Being a leader of the industry, we have successfully developed the VGA to 5M pixel CMOS module products.
They have been used in the mobile phones or 3C product plenty.

* The new technology for PiP(product in Package) is designed for the flash cards.
This technology skill is related to the new module MCP (Multi-Chip package) and can combine many chips in a single package to satisfy the trend of the mobile electronic products.
* Kingpak technology has put in large efforts on developing the skills of DDR2 FBGA in 2000 and gain the patent exchange right from Micron.