KINGPAK Company Brief
Founded Nov. 1997
Headquarter Hsin-Chu, Taiwan
Capital US$ 60 million
Chairman Joe Liu
- Established in 1997, Kingpak Technology Inc. had become one of the major supplier in IC package assembly
services. Kingpak possessing cutting-edge technologies and innovative products, provides the timely
solutions on flash memory, CIS, MEMS, and RF with the turn-key service.
- Being well-known in the industry for the CSP technology, Kingpak has proven market share in light and thin packaging technique; not only is Kingpak the world’s first memory module with Tiny BGA packaging technology, but also one of the leading companies in PIP and CIS packaging technology in Taiwan.
- Kingpak management team is solid and well accredited with 15 years industrial experiences on average.
1997/11 Kingpak was established in 10th November 1997 in Taiwan.
1997/11 Kingpak was approved to register under the Company Law in R.O.C with paid-up capital of Three Hundred
and Ninety-Nine Million and Nine Hundred Thousand New Taiwan Dollars.
1998/05 Developed the technology of FBGA and 16MB DRAM was mass-manufactured.
1998/07 IPO, and increased paid-up capital to One Thousand and One Hundred Ninety-Nine Million New Taiwan
1998/07 Developed and mass-manufactured world first Tiny BGA memory module.
1998/08 Developed the technology of FBGA and mass-manufactured 64MB SDRAM.
1998/09 Developed the technology of Tape BGA.
1998/10 New factory in Chu-Pei was built, and mass-manufactured.
1998/11 The subsidiary company was established in U.S. since 1998.
1999/01 Kingpak was accredited ISO: 9002 since 1999.
1999/08 Developed the technology of MCM package.
1999/10 Tiny BGA ‘s Level Ⅱ reliability test passed.
1999/12 Cooperated with Kingmax Semiconductor Inc. to develop and mass-manufacture Dram Module and won the
award of Taiwan excellencein 1992.
2000/03 Developed the technology CMOS Image Sensor(CIS) & Stacked MCP.
2000/04 Subcontract with Huyndai for IC assembly service.
2000/05 Expansion the facility for CLASS 10.
2001/01 Passed Lead-Free package process.
2001/01 Kingpak was accredited ISO 9001 & QS9000.
2001/07 Pilot run ok for Compact Camera Module(CCM) for CMOS.
2001/08 Image Sensor R-LCC package JEDEC Level 3 Qualified.
2001/08 Same Size Stacked CSP JEDEC Level 3 Qualified by Customer.
2001/09 Lead Free for TFBGA JEDEC Level 3 Qualified by Customer.
2001/10 Cross License with Micron.
2001/11 Developed CSP Window BGA，ranking #1 domestic package house with DDRII mass-manufactured
2002/09 Developed the world first technology of Product in Package (PIP) and applied to the mass-production of SD
Cards, MMC Mobile, etc.
2003/03 Developed the world first technology of color package
2003/07 Developed the technology of Same Die Stacked, mass-manufactured high capacity 512 MB SD MMC Card.
Testing service was available. Provided package and testing turn-key service to customers.
2003/08 Mass-manufacture of the product of CMOS Image sensor.
2003/09 Kingpak was accredited ISO: 14000 since 2003.
2003/11 Mass-manufacture of Digital Storage Cards.
2004/01 Developed the technology of DDR Central Pad Die Stacked, increased the capacity of DRAM.
2004/02 Small-quantity production of Compact Camera Module (CCM).
2004/03 Kingpak was accredited ISO: 9001 since 2004.
2004/05 Provided ODM service of RS MMC Memory Cards for Samsung.
2004/09 Developed the high speed MMC Memory Cards. Increased paid-up capital to One Thousand and Three
Hundred Forty-Nine Million New Taiwan Dollars.
2004/11 Developed 2GB SD Card.
2004/12 Mass-manufacture of ultra-thin (0.70 mm) LGA (Land Grid Array).
2005/03 Developed Micro SD Card (T-Flash).
2005/03 Mass-manufacture of DDRII SDRAM. T5593 was equipped.
2005/08 Mass-manufacture of 64/128 MB Micro SD Card.
2005/09 Development and mass-manufacture of CLCC (5M Pixel).
2005/10 Development and mass-manufacture of Auto Focus CCM (2M Pixel).
2005/12 Mass-manufacture of 256 MB Micro SD Card.
2005/12 Developed Kingpak’s standard CMOS Sensor product by implementing Micron and Samsung’s sensor
roadmaps in order to apply to mobile phone and notebook camera.
2006/03 Mass-manufacture of 512 MB Micro SD Card.
2006/08 Developed Notebook Camera VGA Module (60x8x6.5mm)
2006/08 Mass-manufacture of 2 GB Micro SD Card (4 stacked dies).
2006/11 Developed RF Module 4x6mm with 4 pcs RFIC Developed RF Module (4x6mm with 4 pcs RFIC).
2006/12 Mass-manufacture of 4 GB Micro SD Card (8 stacked dies).
2007/03 Developed Notebook Camera Module (1.3M Pixel).
2007/03 Approved by Investment Commission, M.O.E.A., Taiwan to invest and establish subsidiary company
Truepak Electron (Guangzhou) Ltd. in China in 2007.
2007/04 Developed AF Module with MIPI application.
2007/04 Developed UMPC AF Module (2M Pixel).
2007/05 Developed PLCC (8M Pixel).
2007/06 Developed Auto Testing Machines for CMOS Sensor.
2007/11 Developed molding glass camera module.
2007/11 Developed DVB module (Digital TV)
2008/02 Developed GPS module.
2008/04 Developed ultra-thin video module (Sensor or PCB).
2008/08 Kingpak was accredited ISO: TS16949 since 2008.
2008/09 Developed wafer’s reconstruction on OEM’s basis.
2008/11 Developed MEMS microphone.
2008/11 Withdrawal from being listed in the emerging stock market.
2008/11 Developed auto testing machines for image and DC sensor (VGA to 5M Pixel).
2008/12 Developed IBGA & ILCC on OEM’s basis.
2009/02 Developed ultra-thin TPLCC for ultra-thin panel for notebooks LED.
2009/03 Developed MEMS pressure sensor assembly.
2009/06 Developed MEMS pico projector device assembly.
2009/08 Developed MEMS gyroscope assembly.
2010/01 Developed Wafer Lens Module package.
2010/10 Mass manufacture of IMBGA/IMLCC package.
2011/07 Mass manufacture of IMLCC 3M pixel.
2012/02 Mass manufacture of IMLCC 5M pixel.
2012/05 Trial run of Wafer Lens Module package.