HOMEFavorite

     
New services for SiP
Jan. 2008
Kingpak Technology Inc. announces the addition of new services for SiP (System in Package) .....
勝開科技利基型封裝策略
Jan. 2008
勝開科技走利基型封裝策略,在image sensor、MCP、R/F及MEMS封裝另闢藍天 .....
more
     
PIP
An outstanding of package for small form factor (Flash memory cards: SDC, MMC, RSMMC, and MiniSD ).
BGA/SiP
BGA Technology Kingpaks Stacked MCP(Multi-Chip-Package)packing technology
 
     
Copyright © 2009, KINGPAK Technology Inc. All rights reserved